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ARRAYJ-300XX-64P-PCB Datasheet(PDF) 27 Page - ON Semiconductor |
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ARRAYJ-300XX-64P-PCB Datasheet(HTML) 27 Page - ON Semiconductor |
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27 / 32 page  ArrayJ Series www.onsemi.com 27 Biasing and Readout from the Standard Breakout Boards The purpose of the Breakout Boards is to allow easy access to either standard or fast I/O from individual pixels for testing purposes. It should be stressed that the breakout boards are for evaluation purposes only and do not allow for full readout of all pixels simultaneously. The various Breakout Boards described in this document have features in common. All pixel fast and standard signals are brought out to headers. The header pins can be interfaced with the SMA connectors with the option of routing the signal via a balun transformer. The common I/O consists of all of the substrate connections summed together. It is not recommended to apply the bias to the common I/O. The Breakout Boards are each shipped with 3 x shunt jumpers and 6 x 10 cm wire cables (3 x red, 3 x black) with crimp sockets at each end. All header pins are suitable for use with wire wrapping in addition to the jumpers and crimp socket leads supplied. The ‘NC’ signals are unconnected pins that can be used for prototyping. SMA Connector Each Breakout Board has three SMA connectors that can be used for supplying bias voltage and accessing signals. In addition, each SMA has a balun transformer in close proximity for impedance matching of the fast signals, shown in Figure 13. To interface signals from the array to the SMA connectors, there is a 4−pin header, shown in Figure 12. The pins are labelled; Fin, Fout, I (Inner) and O (Outer). • Fin provides the input to the balun transformer. • Fout is the output of the balun transformer. • I provides direct connection to the inner part of the SMA connector. • O provides direct connection to the outer part of the SMA connector. Balun Transformer The Balun transformer (RFMD RFXF9503) allows impedance matching of the fast output signal to the readout electronics. For a customer considering their own design, the Balun is not required if the readout amplifiers are placed in close proximity to the sensor pixels of the array. For optimized timing performance, the impedance matching and signal propagation from the SiPM sensor to the readout electronics must be carefully considered. Figure 14. (right) photo and (left) schematic of the BOB SMA, balun transformer and 4−pin header arrangement. |
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