ARRAYJ-300XX-64P-PCB datasheet(21/32 Pages) ONSEMI

Part #	ARRAYJ-300XX-64P-PCB

Description	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays

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Manufacturer	ONSEMI [ON Semiconductor]

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ArrayJ Series

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ARRAYJ−300XX−64P−PCB (8 X 8 Array of 3 mm Pixels)

Array Size

Sensor Type

Readout

Board Size

Pixel Pitch

No. Connections

No. Connectors

8 x 8

30035

Pixel

26.68 x 26.68 mm2

3.36 mm

160

2 x 80−way

30020

The ARRAYJ−300XX−64P is comprised of 64 individual

3mm J−Series sensors arranged in a 8 x 8 array. There are

two types: The ARRAYJ−30035−64P has pixels which are

formed of 35 um microcells, and the ARRAYJ−30020−64P

has pixels that are formed of 20 um microcells.

The performance of the individual pixels and details of the

bias to apply can be found in the J−Series datasheet.

Connections to each sensor are provided by two Hirose

80−way connectors, type DF17(2.0)−80DP−0.5v(57).

These connectors mate with the Hirose DF17(2.0)−

80DS−0.5v(57) board−to−board connectors. The 64 SiPM

sensors have all substrate connections (cathodes) connected

together to form a common I/O. The 2 x 80−way connectors

provide connections as follows:

• 64 x fast output

• 64 x standard I/O

• 32 x common I/O

• 4 x shield contacts to the Common

ARRAYJ−300XX−64P−PCB Board Drawing

The complete ARRAYJ−300XX−64P−PCB CAD is available to download.

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ARRAYJ-300XX-64P-PCB Datasheet(PDF) 21 Page - ON Semiconductor

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