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ARRAYJ-300XX-64P-PCB Datasheet(PDF) 19 Page - ON Semiconductor |
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ARRAYJ-300XX-64P-PCB Datasheet(HTML) 19 Page - ON Semiconductor |
19 / 32 page ![]() ArrayJ Series www.onsemi.com 19 ARRAYJ−BOB3−16P (ARRAYJ−300XX−16P Breakout Board) The ARRAYJ−BOB3−16P is an evaluation board allowing easy access to the signals from a ON Semiconductor ARRAYJ−300XX−16P, 3 mm 4 x 4 SiPM array. The Breakout Board has two HIROSE 20−way connectors DF17(3.0)−20DS−0.5v(57). These connectors mate with the Samtec DF17(2.0)−20DP−0.5v(57) board− to−board connectors on the array. All signals on the array are routed via the mating connectors to header pins. These pins are formed by two 20−way (10 x 2 row) 2.54 mm pitch headers. Three SMA connectors and Balun transformers are provided with 4−pin headers to allow any signal to be connected directly to the SMA or via the transformer using jumper wires. Four 7 mm holes are aligned on a 25 mm grid to allow mounting of the board on an optical breadboard. See Appendices A and B for examples of Breakout Board usage. Figure 10. Layout of the ARRAYJ−BOB3−16P. Note that the array corner pixel numbers are shown on the silkscreen of the PCB to ensure correct orientation of the array. |
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