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ARRAYJ-300XX-64P-PCB Datasheet(PDF) 19 Page - ON Semiconductor

Part # ARRAYJ-300XX-64P-PCB
Description  Silicon Photomultiplier (SiPM) High Fill-Factor Arrays
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

ARRAYJ-300XX-64P-PCB Datasheet(HTML) 19 Page - ON Semiconductor

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ArrayJ Series
www.onsemi.com
19
ARRAYJ−BOB3−16P (ARRAYJ−300XX−16P Breakout
Board)
The ARRAYJ−BOB3−16P is an evaluation board
allowing
easy
access
to
the
signals
from
a
ON Semiconductor ARRAYJ−300XX−16P, 3 mm 4 x 4
SiPM array.
The Breakout Board has two HIROSE 20−way
connectors DF17(3.0)−20DS−0.5v(57). These connectors
mate with the Samtec DF17(2.0)−20DP−0.5v(57) board−
to−board connectors on the array. All signals on the array are
routed via the mating connectors to header pins. These pins
are formed by two 20−way (10 x 2 row) 2.54 mm pitch
headers.
Three SMA connectors and Balun transformers are
provided with 4−pin headers to allow any signal to be
connected directly to the SMA or via the transformer using
jumper wires. Four 7 mm holes are aligned on a 25 mm grid
to allow mounting of the board on an optical breadboard.
See Appendices A and B for examples of Breakout Board
usage.
Figure 10. Layout of the ARRAYJ−BOB3−16P. Note that the array corner pixel numbers are shown on the
silkscreen of the PCB to ensure correct orientation of the array.


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