ARRAYJ-300XX-64P-PCB datasheet(10/32 Pages) ONSEMI

Part #	ARRAYJ-300XX-64P-PCB

Description	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays

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Manufacturer	ONSEMI [ON Semiconductor]

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10

BGA Connections for the ARRAYJ−60035−4P−BGA

The fiducial is indicated in the image below. It marks the

location of both pin A1 and pixel 1.

Fiducial

Pin. No

Function

A1

Anode 1

A2

Anode 2

A3

Common Cathode

B1

Anode 3

B2

Anode 4

B3

Common Cathode

C1

Common Cathode

C2

Common Cathode

C3

Common Cathode

ARRAYJ−60035−4P−BGA − Solder Footprint and

Reflow Solder Profile

The BGA package is compatible with standard reflow

solder processes (J−STD−20) and so is ideal for

high−volume manufacturing.

The ARRAYJ−60035−4P−BGA should be mounted

according to specified soldering pad patterns, as shown in

Figure 5 and in the CAD file which can be downloaded here.

The solder pads may be oversized to ease placement of the

carrier on the PCB. Consult with your contract manufacturer

for recommendation based upon placement accuracy

capability.

Solder paste (ON Semiconductor recommend using

no−clean solder paste) must be evenly applied to each

soldering pad to insure proper bonding and positioning of

the array. After soldering, allow at least three minutes for the

component to cool to room temperature before further

operations.

Solder reflow conditions must be in compliance with

J−STD−20, table 5.2. This is summarized in Figure 6. The

number of passes should not be more than 2.

Figure 5. Recommended solder footprint for use with the ARRAYJ−60035−4P−BGA

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ARRAYJ-300XX-64P-PCB Datasheet(PDF) 10 Page - ON Semiconductor

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