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ARRAYJ-300XX-64P-PCB Datasheet(PDF) 1 Page - ON Semiconductor |
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ARRAYJ-300XX-64P-PCB Datasheet(HTML) 1 Page - ON Semiconductor |
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1 / 32 page  © Semiconductor Components Industries, LLC, 2018 January, 2019 − Rev. 6 1 Publication Order Number: ARRAYJ−SERIES/D ArrayJ Series Silicon Photomultiplier (SiPM) High Fill-Factor Arrays ON Semiconductor’s range of J−Series SiPM sensors have been used to create high fill−factor, scaleable arrays. The sensors are mounted onto PCB boards with minimal dead space, forming arrays with industry−leading fill factor of up to 90%. The back of each ArrayJ has either one or more multi−way connectors, or a BGA (ball grid array). These allow access to the fast output* and standard I/O from each pixel in the array, and a common I/O from the summed substrates of the pixels. The ArrayJ products with connectors can be used to interface with the user’s own readout via a mating connector, or to a ON Semiconductor Breakout Board (BOB). The BOBs allow for easy access to the pixel signals and performance evaluation of the arrays. ArrayJ products with the BGA can be reflow soldered to the user’s readout boards, or purchased ready−mounted on a pinned PCB evaluation board for easy testing. A BGA ArrayJ cannot be removed from it’s PCB evaluation board. This contrasts with an ArrayJ with connectors, as multiple arrays can be evaluated with a single BOB. ArrayJ Inputs and Outputs (I/O) Figure 1 summarizes the array schematic for a portion of an ArrayJ. Each SiPM sensor in the array has three electrical connections: fast output, standard output and common. The substrates (cathodes) of all sensors are summed together to form the common I/O. Each individual fast output and standard I/O (anode) are routed to its own output pin. The pixel−level performance of the sensors in the array can be found in the J−Series datasheet. Table of Contents ARRAYJ-60035-64P-PCB (8 X 8 Array of 6 mm Pixels) 2 .................... ARRAYX-BOB6-64P (Breakout Board for the ARRAYJ-60035-64P) 5 ......... ARRAYX-BOB6-64S (Summed Breakout Board for the ARRAYJ-60035-64P) 7 ... ARRAYJ-60035-4P-BGA (2 X 2 Array of 6 mm Pixels) 9 .................... ARRAYJ-60035-4P-PCB (2 X 2 Array of 6 mm Pixels) 12 .................... ARRAYJ-300XX-16P-PCB (4 X 4 Array of 3 mm Pixels) 17 .................. ARRAYJ-BOB3-16P (ARRAYJ-300XX-16P Breakout Board) 19 .............. ARRAYJ-300XX-64P-PCB (8 X 8 Array of 3 mm Pixels) 21 .................. ARRAYJ-BOB3-64P (ARRAYJ-300XX-64P & ARRAYJ-40035-64P Breakout Board) 25 ..................................................... Biasing and Readout from the Standard Breakout Boards 27 ................. Appendix A 29 ......................................................... Appendix B 30 ......................................................... Appendix C 31 ......................................................... Ordering Information 32 ................................................. * The fast output is not available on the 2x2 array (ARRAYJ−60035−4P). www.onsemi.com Figure 1. Signal connections at the pixel level on the ArrayJ products. ATTENTION! Great care should be taken when disconnecting the ArrayJ PCBs from the mating connectors, either on one of the BOBs, or the user’s own boards. The board should be gently levered up, working progressively around the board to lever the PCB from the connector a little on all sides, and then repeating the process until the connectors are free from each other. Use of Scintillators with the ArrayJ Products Please consult the Application Note on the use of scintillators with the TSV arrays. Common S1 F1 S2 F2 Sn+1 Fn+1 Sn+2 Fn+2 |
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