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ARRAYJ-60035-4P-BGA Datasheet(PDF) 7 Page - ON Semiconductor |
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ARRAYJ-60035-4P-BGA Datasheet(HTML) 7 Page - ON Semiconductor |
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7 / 32 page  ArrayJ Series www.onsemi.com 7 ARRAYX−BOB6−64S (Summed Breakout Board for the ARRAYJ−60035−64P) The ARRAYX−BOB6−64S is an evaluation board allowing easy access to the sum of all of standard pixel signals of a ON Semiconductor ARRAYJ− 60035−64P, 6 mm 8 x 8 TSV array, in addition to all of the individual fast output signals. The Breakout Board features two Samtec 80−way connectors, type QSE−040−01−F−D−A. These connectors mate with the Samtec QTE−040−03−F−D−A board−toboard connector on the array. Since the connectors are keyed, orientating the array on the BOB is straightforward. A schematic of the board is shown in Figure 4 below. Fast signals: All of the fast output signals (Fn) from the array are routed via the mating connectors to header pins. These pins are formed of four 50−way (25 x 2 row) 2.54 mm pitch headers; J3, J4, J5 and J6. Each of the four headers also has 10 pins that connect to the common cathode (CM) and 8 pins left unconnected (NC) to allow prototyping for evaluation purposes. Two SMA connectors and Balun transformers are provided with 4−pin headers to allow any fast signal to be connected directly to the SMA or via the transformer using jumper wires. Summed output: A summed output (the anodes of pixels 1 to 64 connected together) is routed to jumper pins (SM) in close proximity to a third SMA connector. Four 7 mm holes are placed on a 25 mm grid to allow mounting of the board on an optical breadboard. See Appendix C for an example of the use of the summed BOB. Figure 4. Layout of the ARRAYX−BOB6−64P. The dimensions of the board are 112 mm x 112 mm. |
Similar Part No. - ARRAYJ-60035-4P-BGA |
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Similar Description - ARRAYJ-60035-4P-BGA |
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