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ARRAYJ-60035-4P-BGA Datasheet(PDF) 5 Page - ON Semiconductor

Part # ARRAYJ-60035-4P-BGA
Description  Silicon Photomultiplier (SiPM) High Fill-Factor Arrays
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

ARRAYJ-60035-4P-BGA Datasheet(HTML) 5 Page - ON Semiconductor

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ArrayJ Series
www.onsemi.com
5
ARRAYX−BOB6−64P (Breakout Board for the
ARRAYJ−60035−64P)
The ARRAYX−BOB6−64P is an evaluation board
allowing easy access to all the signals of a
ON Semiconductor ARRAYJ−60035−64P, 6 mm 8 x 8 TSV
SiPM array.
The Breakout Board features two Samtec 80−way
connectors, type QSE−040−01−F−D−A. These connectors
mate with the Samtec QTE−040−03−F−D−A board−to−
board connector on the array. Since the connectors are
keyed, orientating the array on the BOB is straight−forward.
All signals on the array are routed via the mating
connectors to header pins. These pins are formed of four
50−way (25 x 2 row) 2.54 mm pitch headers; J3, J4, J5 and
J6. Each of the four headers also has 8 pins left unconnected
to allow prototyping for evaluation purposes.
The three SMA connectors on the board can be connected
via the supplied jumper cable to any of the array header pins
and used for accessing signals or suppling bias voltage. Four
7 mm holes are aligned on a 25 mm grid to allow mounting
of the board on an optical breadboard.
See Appendices A and B for examples of Breakout Board
usage.
Figure 3. Layout of the ARRAYX−BOB6−64P. The dimensions of the board are 112 mm x 112 mm.


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