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K4H1G0438M-UC Datasheet(PDF) 16 Page - Samsung semiconductor |
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K4H1G0438M-UC Datasheet(HTML) 16 Page - Samsung semiconductor |
16 / 23 page ![]() DDR SDRAM DDR SDRAM 1Gb M-die (x4, x8) Pb-Free Revision 1.1 October, 2004 Parameter Symbol B3 (DDR333@CL=2.5)) A2 (DDR266@CL=2.0) B0 (DDR266@CL=2.5) Unit Note Min Max Min Max Min Max Mode register set cycle time tMRD 12 15 15 ns DQ & DM setup time to DQS tDS 0.45 0.5 0.5 ns j, k DQ & DM hold time to DQS tDH 0.45 0.5 0.5 ns j, k Control & Address input pulse tIPW 2.2 2.2 2.2 ns 8 DQ & DM input pulse width tDIPW 1.75 1.75 1.75 ns 8 Power down exit time tPDEX 6 7.5 7.5 ns Exit self refresh to non-Read com- tXSNR 75 75 75 ns Exit self refresh to read command tXSRD 200 200 200 tCK Refresh interval time tREFI 7.8 7.8 7.8 us 4 Output DQS valid window tQH tHP -tQHS - tHP -tQHS - tHP -tQHS -ns 11 Clock half period tHP tCLmin or tCHmin - tCLmin or tCHmin - tCLmin or tCHmin - ns 10, 11 Data hold skew factor tQHS 0.55 0.75 0.75 ns 11 DQS write postamble time tWPST 0.4 0.6 0.4 0.6 0.4 0.6 tCK 2 Active to Read with Auto precharge command tRAP 18 20 20 Autoprecharge write recovery + Precharge time tDAL (tWR/tCK) + (tRP/tCK) (tWR/tCK) + (tRP/tCK) (tWR/tCK) + (tRP/tCK) tCK 13 System Characteristics for DDR SDRAM The following specification parameters are required in systems using DDR333 & DDR266 devices to ensure proper sys- tem performance. these characteristics are for system simulation purposes and are guaranteed by design. Table 1 : Input Slew Rate for DQ, DQS, and DM Table 2 : Input Setup & Hold Time Derating for Slew Rate Table 3 : Input/Output Setup & Hold Time Derating for Slew Rate AC CHARACTERISTICS DDR333 DDR266 PARAMETER SYMBOL MIN MAX MIN MAX Units Notes DQ/DM/DQS input slew rate measured between VIH(DC), VIL(DC) and VIL(DC), VIH(DC) DCSLEW TBD TBD TBD TBD V/ns a, m Input Slew Rate tIS tIH Units Notes 0.5 V/ns 0 0 ps i 0.4 V/ns +50 0 ps i 0.3 V/ns +100 0 ps i Input Slew Rate tDS tDH Units Notes 0.5 V/ns 0 0 ps k 0.4 V/ns +75 +75 ps k 0.3 V/ns +150 +150 ps k |
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