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UPD70F3212 Datasheet(PDF) 7 Page - NEC |
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UPD70F3212 Datasheet(HTML) 7 Page - NEC |
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7 / 861 page  User’s Manual U16890EJ1V0UD 7 To find the details of a register where the name is known → Refer to APPENDIX C REGISTER INDEX. To understand the details of an instruction function → Refer to the V850ES Architecture User’s Manual. Register format → The name of the bit whose number is in angle brackets (<>) in the figure of the register format of each register is defined as a reserved word in the device file. To understand the overall functions of the V850ES/KG1 → Read this manual according to the CONTENTS. To know the electrical specifications of the V850ES/KG1 → Refer to CHAPTER 28 ELECTRICAL SPECIFICATIONS (MASK ROM VERSION OF 256 KB AND SINGLE-POWER FLASH MEMORY VERSION) (TARGET), CHAPTER 29 ELECTRICAL SPECIFICATIONS (STANDARD PRODUCTS (MASK ROM VERSION OF 128 KB OR LESS AND TWO-POWER FLASH MEMORY VERSION), (A) GRADE PRODUCTS), CHAPTER 30 ELECTRICAL SPECIFICATIONS ((A1) GRADE PRODUCTS) (TARGET), and CHAPTER 31 ELECTRICAL SPECIFICATIONS ((A2) GRADE PRODUCTS) (TARGET). The “yyy bit of the xxx register” is described as the “xxx.yyy bit” in this manual. Note with caution that if “xxx.yyy” is described as is in a program, however, the compiler/assembler cannot recognize it correctly. Conventions Data significance: Higher digits on the left and lower digits on the right Active low representation: xxx (overscore over pin or signal name) Memory map address: Higher addresses on the top and lower addresses on the bottom Note: Footnote for item marked with Note in the text Caution: Information requiring particular attention Remark: Supplementary information Numeric representation: Binary ... xxxx or xxxxB Decimal ... xxxx Hexadecimal ... xxxxH Prefix indicating power of 2 (address space, memory capacity): K (kilo): 2 10 = 1,024 M (mega): 2 20 = 1,0242 G (giga): 2 30 = 1,0243 |
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