4116369

Rev 9.0

September 04, 2017

7

Contents

1. INTRODUCTION ................................................................................................12

1.1.

Common Flexible Form Factor (CF3) ................................................................................12

1.2.

Physical Dimensions .........................................................................................................13

1.3.

General Features...............................................................................................................13

1.4.

Architecture........................................................................................................................15

1.5.

Interfaces...........................................................................................................................16

1.6.

Connection Interface .........................................................................................................16

1.7.

ESD ...................................................................................................................................17

1.8.

Environmental and Certifications.......................................................................................17

1.8.1.

Environmental Specifications...................................................................................17

1.8.2.

Regulatory................................................................................................................18

1.8.3.

RoHS Directive Compliant .......................................................................................18

1.8.4.

Disposing of the Product..........................................................................................18

1.9.

References ........................................................................................................................18

2. PAD DEFINITION...............................................................................................19

2.1.

Pad Configuration (Top View, Through Module) ...............................................................24

3. DETAILED INTERFACE SPECIFICATIONS .....................................................25

3.1.

Power Supply.....................................................................................................................25

3.2.

Current Consumption ........................................................................................................25

3.3.

VGPIO ...............................................................................................................................26

3.4.

BAT_RTC ..........................................................................................................................27

3.5.

SIM Interface .....................................................................................................................27

3.5.1.

UIM1_DET ...............................................................................................................28

3.6.

USB ...................................................................................................................................28

3.7.

Electrical Information for Digital I/O...................................................................................29

3.8.

General Purpose Input/Output (GPIO) ..............................................................................29

3.9.

Main Serial Link (UART1)..................................................................................................30

3.10.

POWER-ON Signal (PWR_ON_N)....................................................................................31

3.11.

Reset Signal (RESET_IN_N).............................................................................................31

3.12.

Analog to Digital Converter (ADC1) ..................................................................................32

3.13.

Clock Interface...................................................................................................................32

3.14.

PCM...................................................................................................................................33

3.15.

Debug Interfaces ...............................................................................................................34

3.15.1.

Trace Debug ............................................................................................................34

3.15.2.

JTAG........................................................................................................................35

3.16.

RF Interface.......................................................................................................................35

3.16.1.

RF Connection.........................................................................................................35