49

Am29LV800D

Am29LV800D_00_A4_E January 21, 2005

PR EL IM IN A R Y

Revision Summary

Revision A (January 19, 2004)

Changed data sheet status to Advance Informa-

tion to indicate new 0.23 µm process tech-

nology. The base device part number has

changed from Am29LV800B to Am29LV800D.

changed. Extended temperature is no longer

available. All other specifications in the data

sheet remain unchanged. Deleted references to

KGD option in Connection Diagrams section.

(This document was formerly released as publi-

cation 21490, revision H.)

Revision A+1 (February 3, 2004)

Distinctive Characteristics, General Description,

Ordering Information

Deleted references to KGD option. (This docu-

ment was formerly released as publication

21490, revision H1.)

Revision A+2 (April 2, 2004)

General Description

Removed unlock bypass section.

Global

Converted datasheet to Preliminary.

Ordering Information

Added Pb-Free packages and updated Valid

Combinations tables to include changes.

Absolute Maximum Rating

Changed ambient with power applied from

Revision A+3 (June 23, 2004)

Global change

Changed all Helvetica/Times Roman fonts to Gill

Sans For AMD or Verdana.

“Physical Dimensions” on page 47

Added VBK048 Package Drawing.

“Ordering Information” on page 8

Added “WC =...” to Standard Products table.

Added “WCC, WCI, WCD, WCF” to Valid combi-

nations table.

Added Colophon.

Revision A+4 (January 21, 2005)

Added migration statement.

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-

tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-

templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that FASL will not be liable to you

and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices

have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures

into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating condi-

tions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Ex-

change and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior

authorization by the respective government entity will be required for export of those products.

Trademarks

Copyright © 2000–2005 Advanced Micro Devices, Inc. All rights reserved.

AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.

ExpressFlash is a trademark of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.