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SA602AD01 Datasheet(PDF) 19 Page - NXP Semiconductors

Part # SA602AD01
Description  Double-balanced mixer and oscillator
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

SA602AD01 Datasheet(HTML) 19 Page - NXP Semiconductors

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NXP Semiconductors
SA602A
Double-balanced mixer and oscillator
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 27 May 2014
Document identifier: SA602A
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
22. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4.1
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 4
8
Application design-in information . . . . . . . . . . 7
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
10
Thermal characteristics . . . . . . . . . . . . . . . . . . 8
11
Static characteristics . . . . . . . . . . . . . . . . . . . . . 8
12
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
13
Performance curves . . . . . . . . . . . . . . . . . . . . . 9
14
Test information . . . . . . . . . . . . . . . . . . . . . . . . 10
15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
16
Soldering of SMD packages . . . . . . . . . . . . . . 12
16.1
Introduction to soldering . . . . . . . . . . . . . . . . . 12
16.2
Wave and reflow soldering . . . . . . . . . . . . . . . 12
16.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12
16.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13
17
Soldering: PCB footprints. . . . . . . . . . . . . . . . 14
18
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15
19
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
20
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
20.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
20.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
20.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
20.4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
21
Contact information. . . . . . . . . . . . . . . . . . . . . 18
22
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19


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