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SA602AD01 Datasheet(PDF) 19 Page - NXP Semiconductors |
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SA602AD01 Datasheet(HTML) 19 Page - NXP Semiconductors |
19 / 19 page ![]() NXP Semiconductors SA602A Double-balanced mixer and oscillator © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 May 2014 Document identifier: SA602A Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Application design-in information . . . . . . . . . . 7 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Thermal characteristics . . . . . . . . . . . . . . . . . . 8 11 Static characteristics . . . . . . . . . . . . . . . . . . . . . 8 12 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 13 Performance curves . . . . . . . . . . . . . . . . . . . . . 9 14 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 16 Soldering of SMD packages . . . . . . . . . . . . . . 12 16.1 Introduction to soldering . . . . . . . . . . . . . . . . . 12 16.2 Wave and reflow soldering . . . . . . . . . . . . . . . 12 16.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 16.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 17 Soldering: PCB footprints. . . . . . . . . . . . . . . . 14 18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 20.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 20.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 20.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 20.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 21 Contact information. . . . . . . . . . . . . . . . . . . . . 18 22 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 |
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