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06035J1R8BBS Datasheet(PDF) 13 Page - NXP Semiconductors |
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06035J1R8BBS Datasheet(HTML) 13 Page - NXP Semiconductors |
13 / 18 page MMA20312BVT1 13 RF Device Data Freescale Semiconductor, Inc. Figure 21. PCB Pad Layout for QFN 3 3 3.00 3.40 2.00 0.50 0.30 0.70 1.6 1.6 solder pad with thermal via structure. All dimensions in mm. Figure 22. Product Marking MA02 YWZ |
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Similar Description - 06035J1R8BBS |
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