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SN74HCS14

SCLS799 – JANUARY 2020

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(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per

±4000

V

Charged-device model (CDM), per JEDEC

±1500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

2

5

6

V

Input voltage

0

V

Output voltage

0

V

Ambient temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC

SN74HCS14

UNIT

PW (TSSOP)

14 PINS

Junction-to-ambient thermal resistance

151.7

°C/W

Junction-to-case (top) thermal resistance

79.4

°C/W

Junction-to-board thermal resistance

94.7

°C/W

Junction-to-top characterization parameter

25.2

°C/W

Junction-to-board characterization parameter

94.1

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

6.5 Electrical Characteristics

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Positive switching threshold

2 V

0.7

1.5

V

4.5 V

1.7

3.15

6 V

2.1

4.2

Negative switching threshold

2 V

0.3

1.0

V

4.5 V

0.9

2.2

6 V

1.2

3.0

2 V

0.2

1.0

V

4.5 V

0.4

1.4

6 V

0.6

1.6

High-level output voltage

2 V to 6 V

V

4.5 V

4.0

4.3

6 V

5.4

5.75

Low-level output voltage

2 V to 6 V

0.002

0.1

V

4.5 V

0.18

0.30

6 V

0.22

0.33

Input leakage current

6 V

±100

±1000

nA

Supply current

6 V

0.1

2

µA

Input capacitance

2 V to 6 V

5

pF