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LMV321A, LMV324A, LMV358A

SBOS923F – DECEMBER 2017 – REVISED JANUARY 2020

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Product Folder Links: LMV321A LMV324A LMV358A

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Copyright © 2017–2020, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 4

6

Specifications......................................................... 6

6.1

Absolute Maximum Ratings ...................................... 6

6.2

ESD Ratings.............................................................. 6

6.3

Recommended Operating Conditions ....................... 6

6.4

Thermal Information: LMV321A ................................ 7

6.5

Thermal Information: LMV358A ................................ 7

6.6

Thermal Information: LMV324A ................................ 7

6.7

Electrical Characteristics........................................... 8

6.8

Typical Characteristics .............................................. 9

7

Detailed Description ............................................ 15

7.1

Overview ................................................................. 15

7.2

Functional Block Diagram ....................................... 15

7.3

Feature Description................................................. 16

7.4

Device Functional Modes........................................ 16

8

Application and Implementation ........................ 17

8.1

Application Information............................................ 17

8.2

Typical Application .................................................. 17

9

Power Supply Recommendations ...................... 22

9.1

Input and ESD Protection ....................................... 22

10

Layout................................................................... 23

10.1

Layout Guidelines ................................................. 23

10.2

Layout Example .................................................... 23

11

Device and Documentation Support ................. 24

11.1

Documentation Support ........................................ 24

11.2

Related Links ........................................................ 24

11.3

Receiving Notification of Documentation Updates 24

11.4

Support Resources ............................................... 24

11.5

Trademarks ........................................................... 24

11.6

Electrostatic Discharge Caution ............................ 24

11.7

Glossary ................................................................ 24

12

Mechanical, Packaging, and Orderable

Information ........................................................... 24

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (September 2019) to Revision F

Page

•

Added SOT-23 (U) package information to Pin Configuration and Functions section ........................................................... 4

Changes from Revision D (November 2018) to Revision E

Page

•

Added SOT-23 (8) package to Device Information ................................................................................................................ 1

•

Added SOT-23 (8) (DDF) package to the Pin Configuration and Functions section.............................................................. 4

•

Added DDF (SOT-23) package to Thermal Information: LMV358A ....................................................................................... 7

Changes from Revision C (August 2018) to Revision D

Page

•

Changed the document status From: Production Data/Mixed To: Production Data .............................................................. 1

•

Changed LMV321A SOT-23 and SC70 packages From: Preview To: Production ................................................................ 1

•

Changed LMV324A SOIC and TSSOP packages From: Preview To: Production................................................................. 1

•

Deleted DBV (SOT-23) and DCK (SC70) package preview note from the LM321A Thermal Information table .................. 7

•

Deleted D (SOIC) and PW (TSSOP) package preview note from the LM324A Thermal Information table .......................... 7

Changes from Revision B (June 2018) to Revision C

Page

•

Changed Typical Iq feature from 80 µA/Ch to 70 µA/Ch........................................................................................................ 1

•

Changed typical Iq from 80 µA to 70 µA ............................................................................................................................... 8