PACKAGE OPTION ADDENDUM

www.ti.com

5-Dec-2019

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

TMP451AQDQFRQ1

ACTIVE

WSON

DQF

8

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

DAIQ

TMP451AQDQFTQ1

ACTIVE

WSON

DQF

8

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

DAIQ

TMP451AQDQWRQ1

ACTIVE

WSON

DQW

8

3000

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-40 to 125

1A

TMP451AQDQWTQ1

ACTIVE

WSON

DQW

8

250

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-40 to 125

1A

TMP451HQDQFRQ1

ACTIVE

WSON

DQF

8

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

1RUG

TMP451HQDQFTQ1

ACTIVE

WSON

DQF

8

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

1RUG

TMP451HQDQWRQ1

ACTIVE

WSON

DQW

8

3000

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-40 to 125

1H

TMP451HQDQWTQ1

ACTIVE

WSON

DQW

8

250

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-40 to 125

1H

TMP451JQDQFRQ1

ACTIVE

WSON

DQF

8

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

1RVG

TMP451JQDQFTQ1

ACTIVE

WSON

DQF

8

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

1RVG

TMP451JQDQWRQ1

ACTIVE

WSON

DQW

8

3000

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-40 to 125

1J

TMP451JQDQWTQ1

ACTIVE

WSON

DQW

8

250

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-40 to 125

1J

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.