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MC10195 Datasheet(PDF) 3 Page - ON Semiconductor |
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MC10195 Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 4 page MC10195 MOTOROLA MECL Data DL122 — Rev 6 3–166 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). –M– –N– –L– Y BRK W V D D S L–M M 0.007 (0.180) N S T S L–M M 0.007 (0.180) N S T S L–M S 0.010 (0.250) N S T X G1 B U Z VIEW D–D 20 1 S L–M M 0.007 (0.180) N S T S L–M M 0.007 (0.180) N S T S L–M S 0.010 (0.250) N S T C G VIEW S E J R Z A 0.004 (0.100) –T– SEATING PLANE S L–M M 0.007 (0.180) N S T S L–M M 0.007 (0.180) N S T H VIEW S K K1 F G1 DIM MIN MAX MIN MAX MILLIMETERS INCHES A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Y ––– 0.020 ––– 0.50 Z 2 10 2 10 G1 0.310 0.330 7.88 8.38 K1 0.040 ––– 1.02 ––– _ ___ |
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