© 2018 Kingbright. All Rights Reserved. Spec No: DSAM4651 / 1201008348 Rev No: V.7B Date: 05/22/2018

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TECHNICAL DATA

REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS

Notes:

1. Don't cause stress to the LEDs while it is exposed to high temperature.

2. The maximum number of reflow soldering passes is 2 times.

3. Reflow soldering is recommended. Other soldering methods are not recommended as they might

cause damage to the product.

KAAF-5050RGBS-13

HANDLING PRECAUTIONS

Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is

more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone

encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED.

2. Do not directly touch or handle the silicone lens

surface. It may damage the internal circuitry.

1. Handle the component along the

side surfaces by using forceps or

appropriate tools.

3. Do not stack together assembled

PCBs containing exposed LEDs.

Impact may scratch the silicone lens

or damage the internal circuitry.

4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.

4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.

4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure

precise pickup and avoid damage during production.

plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such

substances.

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