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AA3527AVBS-D-30MAV Datasheet(PDF) 4 Page - HK TO-GRACE TECHNOLOGY CO.,LTD. |
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AA3527AVBS-D-30MAV Datasheet(HTML) 4 Page - HK TO-GRACE TECHNOLOGY CO.,LTD. |
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4 / 4 page ![]() © 2017 Kingbright. All Rights Reserved. Spec No: DSAM8767 / 1201008549 Rev No: V.4B Date: 07/20/2017 Page 4 / 4 PACKING & LABEL SPECIFICATIONS PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes AA3527AVBS/D-30MAV HANDLING PRECAUTIONS Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. |
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