67 / 68 page
RTL8101L
2003-05-28
Rev.1.3
67
13. Dimensions
Note:
1.To be determined at seating plane -c-
2.Dimensions D1 and E1 do not include mold protrusion.
Symbol
Dimension in
inch
Dimension in
mm
D1 and E1 are maximum plastic body size dimensions
Min Nom Max Min Nom Max
including mold mismatch.
A
-
-
0.067
-
-
1.70
3.Dimension b does not include dambar protrusion.
A1
0.000 0.004 0.008 0.00 0.1 0.20
Dambar can not be located on the lower radius of the foot.
A2
0.051 0.055 0.059 1.30 1.40 1.50
4.Exact shape of each corner is optional.
B
0.006 0.009 0.011
0.15 0.22 0.29
5.These dimensions apply to the flat section of the lead
b1
0.006 0.008 0.010 0.15 0.20 0.25
between 0.10 mm and 0.25 mm from the lead tip.
C
0.004
-
0.008 0.09
-
0.20
6. A1 is defined as the distance from the seating plane
c1
0.004
-
0.006 0.09
-
0.16
to the lowest point of the package body.
D
0.630 BSC
16.00 BSC
7.Controlling dimension: millimeter.
D1
0.551 BSC
14.00 BSC
8. Reference document: JEDEC MS-026 , BED.
E
0.630 BSC
16.00 BSC
TITLE: 100LD LQFP ( 14x14x1.4mm)
E1
0.551 BSC
14.00 BSC
PACKAGE OUTLINE DRAWING , FOOTPRINT 2.0mm
0.020 BSC
0.50 BSC
LEADFRAME MATERIAL:
L
0.016 0.024 0.031 0.40 0.60 0.80
APPROVE
DOC. NO.
L1
0.039 REF
1.00 REF
VERSION 1
θ
θ
θ
θ
0°
3.5°
9°
0°
3.5°
9°
PAGE
OF
θ
θ
θ
θ1
0°
-
-
0°
-
-
CHECK
DWG NO. LQ100 - P1
θ
θ
θ
θ2
12°TYP
12°TYP
DATE
θ
θ
θ
θ3
12°TYP
12°TYP
REALTEK SEMICONDUCTOR CORP.
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