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Die Size (Unsawn)

1080 x 990

42 x 39

µm

mils

Minimum Bond Pad Size

116 x 116

4.6 x 4.6

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

Low Power Schottky Logic – 74LS04

Hex Inverter Gates Logic IC in bare die form

High speed – 19ns (Typ) propagation delay

Direct drop-in replacement for obsolete

components in long term programs.

Rev 1.0

24/11/17

Features:

Ordering Information

The following part suffixes apply:

No suffix - MIL-STD-883 /2010B Visual Inspection

For High Reliability versions of this product please see

54LS04

Supply Formats:

Mechanical Specification

Default – Die in Waffle Pack (400 per tray capacity)

Sawn Wafer on Tape – On request

Unsawn Wafer – On request

Die Thickness <> 350µm(14 Mils) – On request

Assembled into Ceramic Package – On request

The 74LS04 Hex Inverter is fabricated using a 2µm 40V

Bipolar process. The device contains six independent

inverters with standard push-pull outputs which perform the

Boolean function Y = Ᾱ in positive logic.

 

Description

Die Dimensions in µm (mils)

1080 (42)