Publication Release Date: July, 2008

- II -

Version: 1.3

W83772G

Table of Content-

1.

GENERAL DESCRIPTION ......................................................................................................... 1

2.

FEATURES ................................................................................................................................. 1

2.1

Monitoring Items - Temperature.................................................................................................1

2.2

General ........................................................................................................................................1

2.3

Package .......................................................................................................................................1

3.

KEY SPECIFICATIONS .............................................................................................................. 1

4.

BLOCK DIAGRAM ...................................................................................................................... 2

5.

PIN CONFIGURATION ............................................................................................................... 2

6.

PIN DESCRIPTION..................................................................................................................... 3

7.

FUNCTIONAL DESCRIPTION.................................................................................................... 3

7.1

General Description ....................................................................................................................3

7.2

Access Interface ..........................................................................................................................3

7.3

Power-On Reset..........................................................................................................................4

7.4

Measured Temperature Data Format ........................................................................................4

7.5

Sensor Error Conditions..............................................................................................................5

7.6

Conversion Time .........................................................................................................................5

7.7

Address Selection .......................................................................................................................5

8.

PCB LAYOUT GUIDE ................................................................................................................. 6

9.

COMMAND SUMMARY .............................................................................................................. 7

9.1

Format of PING() .........................................................................................................................7

9.2

Format of ResetDevice().............................................................................................................8

9.3

Format of GetIntTemp() ..............................................................................................................8

9.4

Format of GetExtTemp().............................................................................................................9

9.5

Format of GetAllTemp() ........................................................................................................... 10

10.

ELECTRICAL CHARACTERISTIC ........................................................................................... 11

10.1

Absolute Maximum Ratings..................................................................................................... 11

10.2

DC Characteristics ................................................................................................................... 11

10.3

AC Characteristics.................................................................................................................... 12

11.

ORDER INSTRUCTION............................................................................................................ 13

12.

TOP MARKING SPECIFICATION ............................................................................................ 13

13.

PACKAGE SPECIFICATION .................................................................................................... 14