Will Semiconductor Ltd.

2

2015/04/24 – Rev.1.0

WNM5002

Absolute Maximum ratings

Thermal resistance ratings

a

Surface mounted on FR-4 Board using 1 square inch pad size, 1oz copper

b

Surface mounted on FR-4 board using minimum pad size, 1oz copper

c

Pulse width<380µs, Duty Cycle<2%

d

Parameter

Symbol

10 S

Steady State

Unit

Drain-Source Voltage

50

V

Gate-Source Voltage

±

20

0.50

0.44

A

0.40

0.35

0.69

0.53

W

0.44

0.34

0.47

0.42

A

0.38

0.33

0.60

0.47

W

0.39

0.30

1.2

A

Operating Junction Temperature

-55 to 150

°C

Lead Temperature

260

°C

Storage Temperature Range

-55 to 150

°C

Parameter

Symbol

Typical

Maximum

Unit

t ≤ 10 s

140

180

°C/W

Steady State

176

232

t ≤ 10 s

165

205

Steady State

198

261

Junction-to-Case Thermal Resistance

Steady State

100

120