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MSM6665C-XX Datasheet(PDF) 27 Page - OKI electronic componets |
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MSM6665C-XX Datasheet(HTML) 27 Page - OKI electronic componets |
27 / 31 page 27/31 ¡ Semiconductor MSM6665C-xx FEDL6665C-02 PAD CONFIGURATION Pad Layout Chip size : 6.09 ¥ 4.97mm Passivation film etched hole : 110 ¥ 110mm 92 93 117 1 33 34 X 58 59 Y C15 –2486 –2332 Pad Name X ( µm) Y ( µm) Pad No. Pad Name X ( µm) Y ( µm) C14 –2336 –2332 C13 –2186 –2332 C12 –2036 –2332 C11 –1886 C10 –1736 C9 –1586 C8 –1436 C7 –1286 C6 –1136 C5 C4 C3 C2 C1 VSS VSS5 VSS4 VSS3 –986 –836 –686 –536 –386 –227 –67 83 233 21 VSS1 533 –2332 22 CS 683 23 C/D 833 24 SI 983 25 SHT 1133 26 9D/17D 1283 27 RST 1433 28 SO 1583 29 VDD 1733 30 31 32 33 34 35 36 37 38 39 OSC1 OSC2 OSC3 TEST1 TEST2 TEST3 S80 S79 S78 S77 1891 2308 2489 2639 2870 2870 2870 2870 2870 2870 VSS2 383 40 S76 2870 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –2332 –1797 –1647 –1347 –1197 –1047 –897 –747 1 Pad No. 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Pad Coordinates |
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