Datasheet

BMP280 Digital Pressure Sensor

Page 40

BST-BMP280-DS001-19 | Revision 1.19 | January 2018

Bosch Sensortec

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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.

Note: Specifications within this document are subject to change without notice. Not intended for publication.

7.2 Landing pattern recommendation

For the design of the landing pattern, the following dimensioning is recommended:

Figure 19: Recommended landing pattern (top view); dimensions are in mm

Note: red areas demark exposed PCB metal pads.

•

In case of a solder mask defined (SMD) PCB process, the land dimensions should be

defined by solder mask openings. The underlying metal pads are larger than these openings.

•

In case of a non solder mask defined (NSMD) PCB process, the land dimensions should

be defined in the metal layer. The mask openings are larger than the these metal pads.

0.5

0.55

2.0

8

7

6

5

1

2

3

4