Toshiba TLxH157 Series LEDs

Electrical and Optical Characteristics (Ta=25

o

C)

Part

Number

PWL nm

λP

Material

View

Angle

2

Luminous Intensity

Forward Voltage

Rev Current

min.

typ.

max.

IF@

min.

typ.

max.

IF@

max.

VR@

TLOH157P

612

InGaAlP

22

o

850.00

2800.00

− 20mA

−

2.10

2.50 20mA

50

4V

TLRH157P

644

InGaAlP

22

o

476.00

1700.00

− 20mA

−

1.90

2.50 20mA

50

4V

TLRMH157P

636

InGaAlP

22

o

850.00

2240.00

− 20mA

−

2.05

2.50 20mA

50

4V

TLSH157P

623

InGaAlP

22

o

850.00

2700.00

− 20mA

−

2.10

2.50 20mA

50

4V

TLYH157P

590

InGaAlP

22

o

850.00

2500.00

− 20mA

−

2.10

2.50 20mA

50

4V

−

nm

−

deg

mcd

−

V

−

µ A

−

Precautions

Soldering temperature: 260°C max, soldering time: 3 s max (soldering portion of lead: up to 2 mm from the body of the device).

•

If the lead is formed, the lead should be formed up to 5 mm from the body of the device without forming stress to the resin. Soldering should

be performed after lead forming.

•

This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure that it will not be affected by

this IR light.

•

NOTICE:

TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can

malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when

utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in

which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.

•

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent

TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for

Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..

•

The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment,

office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor

warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause

loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship

instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety

devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk.

•

Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut

or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not

dispose of the products with other industrial waste or with domestic garbage.

•

The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA

CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is

granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others.

•

The information contained herein is subject to change without notice.

•

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