uP3861P

16

uP3861P-DS-F0002, Feb. 2018

www.upi-semi.com

Package Information

Note

1.Package Outline Unit Description:

BSC: Basic. Represents theoretical exact dimension or dimension target

MIN: Minimum dimension specified.

MAX: Maximum dimension specified.

REF: Reference. Represents dimension for reference use only. This value is not a device specification.

TYP. Typical. Provided as a general value. This value is not a device specification.

2.Dimensions in Millimeters.

3.Drawing not to scale.

4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shell not exceed 0.15mm.

SOP-20L

12.60 - 13.00

0.10 - 0.30

0.41 - 1.27

1.27 BSC

Recommended Solder Pad Layout

2.65 MAX

0.70

10

± 0.

1.27

10

± 0.

0.33 - 0.51

0.23 - 0.32