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LMBR1200ETIG Datasheet(PDF) 4 Page - Leshan Radio Company |
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LMBR1200ETIG Datasheet(HTML) 4 Page - Leshan Radio Company |
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4 / 11 page  5.Suggested thermal profile for soldering process 1. Storage environment：Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering LMBR120ET1G thru LMBR1200ET1G Time within 5℃ of actual Peak Temperature(TP) <3sec 10~30sec Tsmax to TL - Ramp-up Rate Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(min to max)(ts) 150℃ 200℃ 60~120sec Average ramp-up rate(TL to TP) <3℃/sec Profile Feature Soldering Condition Time 25℃ to Peak Temperature Ramp-down Rate <6℃/sec <6minutes Time maintained above: - Temperature (TL) - Time(tL) 217℃ 60-260sec Peak Temperature(TP) 255 -0/+5℃ |
Similar Part No. - LMBR1200ETIG |
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Similar Description - LMBR1200ETIG |
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