Soldering Parameters - Reflow Soldering (Surface Mount Devices)

Reflow Condition

Pb - Free assembly

Pre

Heat

150

°C

200

°C

60 -180 Seconds

Average ramp up rate ( Liquids

3

°C/second max

3

°C/second max

Reflo

w

(Liquids)

217

°C

60 -150 Seconds

Precaution for soldering

260 +0/-5

°C

Note that this product will be easily damaged by rapid heating, rapid

cooling or local heating.

Do not give heat shock over 100

°C in the process of soldering. We

recommend to take preheating and gradual cooling

Time within 5

°C of actual peak

20 - 40 Seconds

Ramp-down Rate

6

°C/second max

Time 25

°C to peak Temperature (T

8 minutes Max

Soldering gun procedure

Do not exceed

260

°C

Note the follows, in case of using solder gun for replacement.

1)The tip temperature must be less than 280 for the period within 3

seconds by using soldering gun under 30W

2) The soldering gun tip shall not touch this product directly.

Soldering volume

Note that excess of soldering volume will easily get crack the body of

this product.

Dimensions And Recommended Pad Layout

Symbol

Millimeters

Inches

L

5.70

±0.50

0.224

±0.02

W

5.08

±0.50

0.20

±0.02

3.80

0.15

WB

0.60

±0.25

0.024

±0.01

I

5.5

0.217

J

6.4

0.252

K

4.2

0.165

Ramp-down

Preheat

Critical Zone

Time to peak temperature

(t 25℃ to peak)

25

Ramp-up

Time

Recommended Soldering Pad Layout