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CSTNE12M0G55Z000R0 Datasheet(PDF) 9 Page - Murata Manufacturing Co., Ltd.

Part # CSTNE12M0G55Z000R0
Description  Specification of Piezoelectric Ceramic Resonator
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Manufacturer  MURATA [Murata Manufacturing Co., Ltd.]
Direct Link  http://www.murata.com
Logo MURATA - Murata Manufacturing Co., Ltd.

CSTNE12M0G55Z000R0 Datasheet(HTML) 9 Page - Murata Manufacturing Co., Ltd.

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Document No. JGC42-8833A
株式会社
村
田
製
作
所
Murata Manufacturing Co.,Ltd.
P. 9/16
11. 耐候性能
Environmental Characteristics
項
目
Item
試 験 条 件
Test Condition
試験後の規格
Specification
After Test
11-1
高温放置
High
Temperature
Exposure
(Storage)
製品を試験用基板に実装した状態で、温度+125±2℃
の恒温槽中に1000時間保持した後、室温に取り出し、
1時間放置した後、測定します。試験方法はIEC60068-
2-2に準拠します。
Component shall be soldered on the test board.
Then it shall be kept in a chamber at +125±2°C for
1000 hours. And then it shall be measured after
leaving at room temperature for 1 hour. Testing
procedure is accordance with IEC60068-2-2.
表1及び5-5を満足しま
す。
The measured values
shall
meet Table 1
and Item 5-5.
11-2
低温放置
Cold
(Storage)
製品を試験用基板に実装した状態で、温度-55±2℃の
恒温槽中に1000時間保持した後、室温に取り出し、1
時間放置した後、測定します。試験方法はIEC60068-
2-1に準拠します。
Component shall be soldered on the test board.
Then it shall be kept in a chamber at -55±2°C for
1000 hours. And then it shall be measured after
leaving at room temperature for 1 hour. Testing
procedure is accordance with IEC60068-2-1.
表1及び5-5を満足しま
す。
The measured values
shall
meet Table 1
and Item 5-5.
11-3
高温高湿放置
Humidity
製品を試験用基板に実装した状態で、温度+60±2℃湿
度90～95%R.H.の恒温恒湿槽中にて1000時間保持し
た後、室温に取り出し、1時間放置した後、測定します。
試験方法はIEC60068-2-78に準拠します。
Component shall be soldered on the test board.
Then it shall be kept in a chamber at +60±2°C, 90 to
95%R.H. for 1000 hours. And then it shall be
measured after leaving at room temperature for 1
hour.
Testing
procedure
is
accordance
with
IEC60068-2-78.
表1及び5-5を満足しま
す。
The measured values
shall
meet Table 1
and Item 5-5.
11-4
熱衝撃
Temperature
Cycling
製品を試験用基板に実装した状態で、温度-55℃の恒
温槽中に30分間保持後、温度+125℃の恒温槽中に直
ちに移し、30分間保持する。これを1サイクルとし、10サ
イクル行った後、室温に取り出し、1時間放置した後、測
定します｡試験方法はJISC60068-2-14に準拠します。
Component shall be soldered on the test board.
After performing 10 cycles of thermal test (-55°C
for 30 minutes to +125°C for 30 minutes), it shall be
measured after leaving at room temperature for 1
hour.
Testing
procedure
is
accordance
with
JISC60068-2-14.
表1及び5-5を満足しま
す。
The measured values
shall
meet Table 1
and Item 5-5.


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