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E32-R21 Datasheet(PDF) 39 Page - Omron Electronics LLC |
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E32-R21 Datasheet(HTML) 39 Page - Omron Electronics LLC |
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39 / 108 page  E32 E32 40 J DIFFUSE, CONVERGENT TYPES (CONT.) Legend: A E3X-A (General purpose amplifier) ....... DAN-HS E3X-DAN (Digital amplifier-- high speed mode) DAN-LD E3X-DAN (Digital amplifier-- long distance mode) DAN-SM E3X-DAN (Digital amplifier-- standard distance mode) F E3X-F (High performance amplifier-- high speed) ....... H E3X-H11 (High gain amplifier) ....... NM E3X-NM (4 channel auto-tuning amplifier) ..... NT E3X-NT (Auto-tuning amplifier: general purpose) ..... NH E3X-NH (High-precision, auto-tuning amplifier) ..... NHB E3X-NHB (High-precision, blue LED, auto-tuning amp) .... NV E3X-NV21 (Water-resistant, red light source amplifier) ..... NVG E3X-NVG21 (Water-resistant, green light source amp) .... VG E3X-VG (Mark sensing amplifier) ..... Application Features Appearance Type Detection distance (see note) Min. detectable object (gold wire) Part number Wafer Convergent beam A 3.3 mm 0.03 mm dia. E32-L25 Wafer detection, height Convergent beam suppresses back- ground objects; DAN-HS 3.3 mm -------------------------- E32-L25 height differences ground objects; cable exits the side; 2 m (6.56 ft) length DAN-LD 3.3 mm -------------------------- differences cable exits the side; 25 mm bending radius DAN-SM 3.3 mm 0.01 mm dia. radius F 3.3 mm 0.5 mm dia. H 3.3 mm 0.015 mm dia. NH 3.3 mm 0.012 mm dia. NHB NA NA NM 3.3 mm 0.015 mm dia. NT 3.3 mm 0.012 mm dia. NV 3.3 mm 0.012 mm dia. NVG NA NA VG NA NA Wafer d i Convergent beam b k A 3.3 mm 0.03 mm dia. E32-L25A Wafer detection, height Convergent beam suppresses back- ground objects; DAN-HS 3.3 mm -------------------------- E32-L25A height differences ground objects; cable exits the b 2 DAN-LD 3.3 mm -------------------------- bottom; 25 mm bending radius 2 m (6.56 ft) length DAN-SM 3.3 mm 0.01 mm dia. bending radius 2 m (6.56 ft) length F 3.3 mm 0.5 mm dia. H 3.3 mm 0.015 mm dia. NH 3.3 mm 0.012 mm dia. NHB NA NA NM 3.3 mm 0.015 mm dia. NT 3.3 mm 0.012 mm dia. NV 3.3 mm 0.012 mm dia. NVG NA NA VG NA NA Wafer Long distance con- A 7.2 ± 1.8 mm 0.015 mm dia. E32-L25L Wafer detection, height Long distance con vergent beam type suppresses back- 2 m (6 56 ft) length DAN-HS 7.2 ± 1.8 mm -------------------------- E32-L25L height differences suppresses back- ground objects; bl i h id 2 m (6.56 ft) length DAN-LD 7.2 ± 1.8 mm -------------------------- g j ; cable exits the side; 10 mm bending DAN-SM 7.2 ± 1.8 mm 0.01 mm dia. 10 mm bending radius F 7.2 ± 1.8 mm 0.015 mm dia. H 7.2 ± 1.8 mm 0.015 mm dia. NH 7.2 ± 1.8 mm 0.012 mm dia. NHB NA NA NM 7.2 ± 1.8 mm 0.015 mm dia. NT 7.2 ± 1.8 mm 0.012 mm dia. NV 7.2 ± 1.8 mm 0.012 mm dia. NVG NA NA VG NA NA Note: Sensing distance is based on sensing a white paper that has 90% reflectivity. |
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Similar Description - E32-R21 |
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