Preliminary

GaN MMIC

GM27030010D

Korean Facilities : 82-31-8069-3036 / rfsales@rfhic.com

All specifications may change without notice

US Facility : 919-677-8780 / sales@rfhicusa.com

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Version 0.1

Assembly Diagram

Ground is backside of die

VG & VD connection must be biased from both sides.

Recommended solder is AuSn(80/20) solder

Evaluation board dimension

VG1

VD1

VG2

VD2

VG1

VD1

VG2

VD2

RF_IN

RF_OUT

0.05mm GAP

0.7mil GOLD WIRE

VG1/2

VD1/2

VG1/2

VD1/2

NC

NC