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AD9523 Datasheet(PDF) 42 Page - Analog Devices |
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AD9523 Datasheet(HTML) 42 Page - Analog Devices |
42 / 60 page ![]() AD9523 Data Sheet Rev. D | Page 42 of 60 Example 1 (868 mW × 20.1°C/W) = 17.4°C With an ambient temperature of 85°C, the junction temperature is TJ = 85°C + 17.4°C = 102°C This junction temperature is below the maximum allowable. Example 2 (2500 mW × 20.1°C/W) = 50.2°C With an ambient temperature of 85°C, the junction temperature is TJ = 85°C + 50°C = 135°C This junction temperature exceeds the maximum allowable range. To operate in the condition of Example 2, the ambient temperature must be lowered to 65°C. THERMALLY ENHANCED PACKAGE MOUNTING GUIDELINES See the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP), for more information about mounting devices with an exposed paddle. |
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