Data Sheet

ADCLK946

Rev. B | Page 5 of 12

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

Supply Voltage

6.0 V

Input Voltage

CLK, CLK

Termination)

±40 mA

CLK to CLK

±1.8 V

±2 V

Maximum Voltage on Output Pins

Maximum Output Current

35 mA

Operating Temperature Range

Ambient

−40°C to +85°C

Junction

150°C

Storage Temperature Range

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

DETERMINING JUNCTION TEMPERATURE

To determine the junction temperature on the application

printed circuit board (PCB), use the following equation:

where:

is the junction temperature (°C).

is the case temperature (°C) measured by the customer at

the top center of the package.

Ψ

JT

is as indicated in Table 5.

is the power dissipation.

and PCB design considerations.

ESD CAUTION

THERMAL PERFORMANCE

Table 5.

Parameter

Symbol

Description

Unit

Junction-to-Ambient Thermal Resistance

Still Air

0.0 m/sec Airflow

Per JEDEC JESD51-2

54.3

°C/W

Moving Air

1.0 m/sec Airflow

Per JEDEC JESD51-6

47.5

°C/W

2.5 m/sec Airflow

Per JEDEC JESD51-6

42.6

°C/W

Junction-to-Board Thermal Resistance

Moving Air

1.0 m/sec Airflow

Per JEDEC JESD51-8 (moving air)

33.0

°C/W

Junction-to-Case Thermal Resistance (Die-to-Heat Sink)

Moving Air

Per MIL-Std. 883, Method 1012.1

2.0

°C/W

Junction-to-Top-of-Package Characterization Parameter

Still Air

0 m/sec Airflow

Per JEDEC JESD51-2

0.9

°C/W

application to determine if they are similar to those assumed in these calculations.