AFIC31025N AFIC31025GN

11

RF Device Data

NXP Semiconductors

PRODUCT DOCUMENTATION

Refer to the following resources to aid your design process.

Application Notes

 AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages

 AN1955: Thermal Measurement Methodology of RF Power Amplifiers

 AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family

 AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family

Engineering Bulletins

 EB212: Using Data Sheet Impedances for RF LDMOS Devices

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REVISION HISTORY

The following table summarizes revisions to this document.

Revision

Date

Description

0

Oct. 2017

 Initial release of data sheet