3

HDSP-501B

Parameter

Symbol

HDSP-503B

Units

Power Dissipated per Segment or DP

135

mW

Peak Forward Current per Segment or DP

70

mA

(1/10 Duty Cycle, 0.1 ms Pulse Width)

mA

Reverse Voltage per Segment or DP

5V

Operating Temperature

–20 to +80

°C

Storage Temperature

–30 to +85

°C

Wave Soldering Conditions

Temperature

250

°C

(1.6 mm [0.063 in.] below Body)

Time

3

s

Note:

1. Derate above 25

°C at 0.33 mA/°C.

Devices

Test

HDSP-

Parameter

Symbol

Min.

Typ.

Max. Units Conditions

Luminous Intensity/Segment

2.02

3.40

mcd

501B

Forward Voltage/Segment or DP

3.80

4.50

V

503B

Peak Wavelength

λ

PEAK

428

nm

λ

d

466

nm

100

µAV

Bin Name

H

2020

2630

I

2630

3420

J

3420

4200

K

4200

5040

Notes:

1. Bin categories are established for classification of products. Products may not be

available in all bin categories.

2. Tolerance for each bin limit is

± 10%.

µcd at 10 mA)

Notes:

1. Case temperature of the device immediately prior to the intensity measurement is 25

°C.

2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.

3. The dominant wavelength,

the color of the device.

4. Typical specification for reference only. Do not exceed absolute maximum ratings.