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LMV358AIDGKT Datasheet(PDF) 2 Page - Texas Instruments |
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LMV358AIDGKT Datasheet(HTML) 2 Page - Texas Instruments |
2 / 37 page 2 LMV321A, LMV358A, LMV324A SBOS923B – DECEMBER 2017 – REVISED JUNE 2018 www.ti.com Product Folder Links: LMV321A LMV358A LMV324A Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 5 6.1 Absolute Maximum Ratings ...................................... 5 6.2 ESD Ratings.............................................................. 5 6.3 Recommended Operating Conditions ....................... 5 6.4 Thermal Information: LMV321A ................................ 6 6.5 Thermal Information: LMV358A ................................ 6 6.6 Thermal Information: LMV324A ................................ 6 6.7 Electrical Characteristics........................................... 7 6.8 Typical Characteristics .............................................. 8 7 Detailed Description ............................................ 14 7.1 Overview ................................................................. 14 7.2 Functional Block Diagram ....................................... 14 7.3 Feature Description................................................. 15 7.4 Device Functional Modes........................................ 15 8 Application and Implementation ........................ 16 8.1 Application Information............................................ 16 8.2 Typical Application ................................................. 16 9 Power Supply Recommendations ...................... 21 9.1 Input and ESD Protection ....................................... 21 10 Layout................................................................... 22 10.1 Layout Guidelines ................................................. 22 10.2 Layout Example .................................................... 22 11 Device and Documentation Support ................. 23 11.1 Documentation Support ........................................ 23 11.2 Related Links ........................................................ 23 11.3 Receiving Notification of Documentation Updates 23 11.4 Community Resources.......................................... 23 11.5 Trademarks ........................................................... 23 11.6 Electrostatic Discharge Caution ............................ 23 11.7 Glossary ................................................................ 23 12 Mechanical, Packaging, and Orderable Information ........................................................... 23 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (May 2018) to Revision B Page • Added SOT-23 package to Device Information table ............................................................................................................ 1 • Added SC70 package to Device Information table ............................................................................................................... 1 • Added TSSOP-8 package to Device Information table ......................................................................................................... 1 • Added SOIC-14 package to Device Information table .......................................................................................................... 1 • Added TSSOP-14 package to Device Information table ....................................................................................................... 1 • Added Thermal Information: LMV321A .................................................................................................................................. 6 • Added Thermal Information: LMV324A ................................................................................................................................. 6 Changes from Original (December 2017) to Revision A Page • Changed device status from Advance Information to Production Data/Mixed Status............................................................ 1 • Added TSSOP to LMV358A D, DGK, PW Packages to Pin Configuration and Functions table ........................................... 3 • Added DGK and PW package to Thermal Information table ................................................................................................. 6 |
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