Substrate Bending test

・Test substrate

Material

: Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)

Copper foil thickness : 0.035mm

　　　　　　　　　　　: Solder resist

(Coat with heat resistant resin for solder)

Fig.1

(in mm)

・Test substrate

Kind of Solder : Sn-3.0Ag-0.5Cu

・Test substrate

Pressurization method

Fig.2

(in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material

: Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

・Test substrate

Kind of Solder : Sn-3.0Ag-0.5Cu

・Test substrate

Land Dimensions

Fig.3

Type

Applied Force(N)

GRM02

1

GRM03

2

GRM15/GRM18

5

GRM21/GRM31/GRM32

10

＊2

4.0±0.1

0.05以下

＊1

-0

Ａ

t

*1,2：2.0±0.05

100

a

b

Land

f4.5

Type

Dimension (mm)

a

b

c

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

Type

Dimension (mm)

a

b

c

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

b

a

Solder Resist

Chip Capacitor

Land

45

45

Flexure:≦1

Capacitance meter

Pressurization

speed

1.0mm/s

Support

Capacitor

Pressurize

45

45

R5

20

50 min.

JEMCGS-04590A

5