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GRM0225C1E4R1WA03 Datasheet(PDF) 18 Page - Murata Manufacturing Co., Ltd. |
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GRM0225C1E4R1WA03 Datasheet(HTML) 18 Page - Murata Manufacturing Co., Ltd. |
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18 / 30 page  4-2.Flow Soldering 1. Do not apply flow soldering to chips not listed in Table 2. [Standard Conditions for Flow Soldering] Table 2 Series GRM 2. When sudden heat is applied to the components, the mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. In order to prevent mechanical damage to the components, preheating is required for both of the components and the PCB. Preheating conditions are shown in table 2. It is required to [Allowable Flow Soldering Temperature and Time] keep the temperature differential between the solder and the components surface (ΔT) as low as possible. 3. Excessively long soldering time or high soldering temperature can result in leaching of the terminations, causing poor adhesion or a reduction in capacitance value due to loss of contact between the inner electrodes and terminations. 4. When components are immersed in solvent after mounting, be sure to maintain the temperature differential (ΔT) between the component and solvent within the range shown in the table 2. In the case of repeated soldering, the accumulated soldering time must be within the range shown above. Recommended Conditions Lead Free Solder: Sn-3.0Ag-0.5Cu 5. Optimum Solder Amount for Flow Soldering 5-1. The top of the solder fillet should be lower than the thickness of the components. If the solder amount is excessive, the risk of cracking is higher during board bending or any other stressful condition. Temperature Differential Caution Lead Free Solder Preheating Peak Temperature Soldering Peak Temperature Chip Dimension(L/W) Code 18/21/31 ΔT≦150℃ Atmosphere 100 to 120℃ 250 to 260℃ Air or N2 ! Soldering Time(s) 280 270 260 250 240 230 220 0 10 20 40 30 Temperature(℃) Soldering Peak Temperature Preheating Peak Temperature 30-90 seconds Preheating 5 seconds max. Time Gradual Cooling Soldering ΔT Up to Chip Thickness Adhesive in section JEMCGC-2701X 18 |
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