4-1.Reflow Soldering

1. When sudden heat is applied to the components, the

[Standard Conditions for Reflow Soldering]

mechanical strength of the components will decrease

because a sudden temperature change causes

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both the components and the PCB.

Preheating conditions are shown in table 1. It is required to

keep the temperature differential between the solder and

the components surface (ΔT) as small as possible.

2. Solderability of tin plating termination chips might be

deteriorated when a low temperature soldering profile where

the peak solder temperature is below the melting point of

tin is used. Please confirm the solderability of tin plated

termination chips before use.

3. When components are immersed in solvent after mounting,

be sure to maintain the temperature difference (ΔT)

between the component and the solvent within the range

[Allowable Reflow Soldering Temperature and Time]

shown in the table 1.

Table 1

Series

GRM

GRM

In the case of repeated soldering, the accumulated

Recommended Conditions

soldering time must be within the range shown above.

Lead Free Solder: Sn-3.0Ag-0.5Cu

4. Optimum Solder Amount for Reflow Soldering

4-1. Overly thick application of solder paste results in a excessive solder fillet height.

This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.

4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose

from the PCB.

4-3. Please confirm that solder has been applied smoothly to the termination.

Make sure not to impose any abnormal mechanical shocks to the PCB.

Caution

Lead Free Solder

Peak Temperature

Atmosphere

ΔT≦130℃

Temperature Differential

Inverting the PCB

240 to 260℃

Chip　Dimension(L/W)　Code

01/02/03/15/18/21/31

32/43/55

ΔT≦190℃

!

Temperature(℃)

Peak Temperature

Soldering

Gradual

Cooling

Preheating

ΔT

60-120 seconds

30-60 seconds

Time

190℃

170℃

150℃

220℃

Soldering Time(s)

280

270

260

250

240

230

220

0

30

60

120

90

JEMCGC-2701X

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