Test method : Substrate Bending test

・Test substrate

Material

: Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)

Copper foil thickness : 0.035mm

: Solder resist

(Coat with heat resistant resin for solder)

Fig.1

(in mm)

・Kind of Solder : Sn-3.0Ag-0.5Cu

・Pressurization method

Fig.2

(in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material

: Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

・ Kind of Solder : Sn-3.0Ag-0.5Cu

・ Land Dimensions

　

Fig.3

Type

Applied Force(N)

GRM02

1

GRM03

2

GRM15/GRM18

5

GRM21/GRM31/GRM32

10

b

a

Solder Resist

Chip Capacitor

Land

These Part Numbers are designed for use in the circuits w here

continuous applied voltage to the capacitor is derated than rated

voltage, and guarantee Durability Test w ith 100% × rated voltage

as testing voltage at the maximum operating temperature.

The voltage and temperature derating conditions on the left are

recommended for use to ensure the same reliability level as

normal specification.

＊2

4.0±0.1

0.05以下

＊1

-0

Ａ

t

*1,2：2.0±0.05

100

a

b

Land

f4.5

Type

Dimension (mm)

a

b

c

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

45

45

Flexure

Capacitance meter

Pressurization

speed

1.0mm/s

Support

Capacitor

Pressurize

45

45

R5

20

50 min.

Type

Dimension (mm)

a

b

c

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

JEMCGS-00047W

5