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MK22FN128VMP10 Datasheet(PDF) 4 Page - NXP Semiconductors |
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MK22FN128VMP10 Datasheet(HTML) 4 Page - NXP Semiconductors |
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4 / 74 page  Table of Contents 1 Ratings.................................................................................... 5 1.1 Thermal handling ratings................................................. 5 1.2 Moisture handling ratings................................................ 5 1.3 ESD handling ratings.......................................................5 1.4 Voltage and current operating ratings............................. 5 2 General................................................................................... 6 2.1 AC electrical characteristics.............................................6 2.2 Nonswitching electrical specifications..............................6 2.2.1 Voltage and current operating requirements....... 6 2.2.2 LVD and POR operating requirements................7 2.2.3 Voltage and current operating behaviors.............8 2.2.4 Power mode transition operating behaviors........ 9 2.2.5 Power consumption operating behaviors............ 10 2.2.6 EMC radiated emissions operating behaviors..... 17 2.2.7 Designing with radiated emissions in mind..........18 2.2.8 Capacitance attributes.........................................18 2.3 Switching specifications...................................................18 2.3.1 Device clock specifications..................................18 2.3.2 General switching specifications......................... 19 2.4 Thermal specifications.....................................................20 2.4.1 Thermal operating requirements......................... 20 2.4.2 Thermal attributes................................................20 3 Peripheral operating requirements and behaviors.................. 21 3.1 Core modules.................................................................. 21 3.1.1 SWD electricals .................................................. 21 3.1.2 JTAG electricals.................................................. 22 3.2 System modules.............................................................. 25 3.3 Clock modules................................................................. 25 3.3.1 MCG specifications..............................................25 3.3.2 IRC48M specifications.........................................27 3.3.3 Oscillator electrical specifications........................28 3.3.4 32 kHz oscillator electrical characteristics........... 30 3.4 Memories and memory interfaces................................... 31 3.4.1 Flash electrical specifications.............................. 31 3.4.2 EzPort switching specifications........................... 32 3.5 Security and integrity modules........................................ 33 3.6 Analog............................................................................. 33 3.6.1 ADC electrical specifications............................... 34 3.6.2 CMP and 6-bit DAC electrical specifications....... 38 3.6.3 12-bit DAC electrical characteristics....................40 3.6.4 Voltage reference electrical specifications.......... 43 3.7 Timers..............................................................................44 3.8 Communication interfaces............................................... 44 3.8.1 USB electrical specifications............................... 45 3.8.2 DSPI switching specifications (limited voltage range).................................................................. 45 3.8.3 DSPI switching specifications (full voltage range).................................................................. 47 3.8.4 Inter-Integrated Circuit Interface (I2C) timing...... 48 3.8.5 UART switching specifications............................ 50 3.8.6 I2S/SAI switching specifications.......................... 50 4 Dimensions............................................................................. 56 4.1 Obtaining package dimensions....................................... 56 5 Pinout...................................................................................... 57 5.1 K22 Signal Multiplexing and Pin Assignments.................57 5.2 Recommended connection for unused analog and digital pins........................................................................62 5.3 K22 Pinouts..................................................................... 63 6 Part identification.....................................................................67 6.1 Description.......................................................................67 6.2 Format............................................................................. 67 6.3 Fields............................................................................... 68 6.4 Example...........................................................................68 6.5 121-pin XFBGA part marking.......................................... 69 6.6 64-pin MAPBGA part marking......................................... 69 7 Terminology and guidelines.................................................... 69 7.1 Definitions........................................................................69 7.2 Examples.........................................................................70 7.3 Typical-value conditions.................................................. 70 7.4 Relationship between ratings and operating requirements....................................................................71 7.5 Guidelines for ratings and operating requirements..........71 8 Revision History...................................................................... 71 4 Kinetis K22F 128KB Flash, Rev. 7, 08/2016 NXP Semiconductors |
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