Rev. 1.3

Page 7 of 9

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Manufacturing Guidelines

1) No Ultrasonic Cleaning. Do not subject the SiT1630 to an ultrasonic cleaning environment. Permanent damage or long

term reliability issues to the MEMS structure may occur.

2) For Noisy, high EM environments, we recommend the following design guidelines:



Place oscillator as far away from EM noise sources as possible (e.g., high-voltage switching regulators, motor drive control).



Route noisy PCB traces, such as digital data lines or high di/dt power supply lines, away from the SiTime oscillator.



Add a low ESR/ESL, 0.1uF to 1.0uF ceramic capacitor (X7R) to help filter high frequency noise on the Vdd power-

supply line. Place it as close to the SiTime oscillator Vdd pin as possible.



Place a solid GND plane underneath the SiTime oscillator to shield the oscillator from noisy traces on the other board

layers.

3) For additional manufacturing guidelines and marking/tape-reel instructions, click on the following link:

http://www.sitime.com/component/docman/doc_download/243-manufacturing-notes-for-sitime-oscillators