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10C150 Datasheet(PDF) 3 Page - Advanced Power Electronics Corp. |
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10C150 Datasheet(HTML) 3 Page - Advanced Power Electronics Corp. |
3 / 8 page AP10C150MT P-CH Electrical Characteristics@Tj=25 oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Unit BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=-250uA -100 - - V RDS(ON) Static Drain-Source On-Resistance 2 VGS=-10V, ID=-2A - - 160 mΩ VGS=-5V, ID=-1A - - 250 mΩ VGS(th) Gate Threshold Voltage VDS=VGS, ID=-250uA -1 - -3 V gfs Forward Transconductance VDS=-10V, ID=-2A - 7.5 - S IDSS Drain-Source Leakage Current VDS=-80V, VGS=0V - - -25 uA IGSS Gate-Source Leakage VGS=+20V, VDS=0V - - +100 nA Qg Total Gate Charge ID=-2A - 32 51.2 nC Qgs Gate-Source Charge VDS=-50V - 5.5 - nC Qgd Gate-Drain ("Miller") Charge VGS=-10V - 5 - nC td(on) Turn-on Delay Time VDS=-50V - 12 - ns tr Rise Time ID=-1A - 4 - ns td(off) Turn-off Delay Time RG=3.3Ω -46- ns tf Fall Time VGS=-10V - 17 - ns Ciss Input Capacitance VGS=0V - 1900 3040 pF Coss Output Capacitance VDS=-50V - 60 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 45 - pF Rg Gate Resistance f=1.0MHz - 6 12 Ω Source-Drain Diode Symbol Parameter Test Conditions Min. Typ. Max. Units VSD Forward On Voltage 2 IS=-2.9A, VGS=0V - - -1.3 V trr Reverse Recovery Time IS=-2A, VGS=0V - 25 - ns Qrr Reverse Recovery Charge dI/dt=-100A/µs - 33 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 3 3.Surface mounted on 1 in 2 copper pad of FR4 board, t <10sec ; 85oC/W at steady state. . |
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