Document Number: 001-94722 Rev. *E

Page 19 of 29

CY7C1441KV25

Automatic CE Power Down

Current – TTL Inputs

Inputs Switching

7.5 ns cycle,

133 MHz

–90

mA

Automatic CE Power Down

Current – CMOS Inputs

f = 0, Inputs Static

7.5 ns cycle,

133 MHz

–80

mA

Automatic CE Power Down

Current – CMOS Inputs

7.5 ns cycle,

133 MHz

–90

mA

Automatic CE Power Down

Current – TTL Inputs

f = 0, Inputs Static

7.5 ns cycle,

133 MHz

–80

mA

Over the Operating Range

Description

Test Conditions

Min

Max

Unit

Capacitance

Parameter [16]

Description

Test Conditions

165-ball FBGA

Max

Unit

Input capacitance

5

pF

Clock input capacitance

5

pF

Input/Output capacitance

5

pF

Thermal Resistance

Parameter [16]

Description

Test Conditions

165-ballFBGA

Package

Unit

Thermal resistance

(junction to ambient)

Test conditions follow standard test

methods

and

procedures

for

measuring thermal impedance,

per EIA/JESD51.

With Still Air (0 m/s)

14.24

°C/W

With Air Flow (1 m/s)

12.47

°C/W

With Air Flow (3 m/s)

11.40

°C/W

Thermal resistance

(junction to case)

–3.92

°C/W

Thermal resistance

(junction to board)

7.19

°C/W

AC Test Loads and Waveforms

Figure 3. AC Test Loads and Waveforms

OUTPUT

R = 1667



R = 1538



5pF

INCLUDING

JIG AND

SCOPE

(a)

(b)

OUTPUT

2.5V

ALL INPUT PULSES

GND

90%

10%

90%

10%

2 V/ns

 1 ns

(c)

2.5 V I/O Test Load

Note

16. Tested initially and after any design or process change that may affect these parameters.