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CY7C1440KV25 Datasheet(PDF) 19 Page - Cypress Semiconductor |
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CY7C1440KV25 Datasheet(HTML) 19 Page - Cypress Semiconductor |
19 / 30 page CY7C1440KV25 Document Number: 001-94719 Rev. *D Page 19 of 30 IDD VDD Operating Supply Current VDD = Max, IOUT = 0 mA, f = fMAX = 1/tCYC 4-ns cycle, 250 MHz –240 mA ISB1 Automatic CE Power-down Current – TTL Inputs VDD = Max, Device Deselected, VIN VIH or VIN VIL, f = fMAX = 1/tCYC All speeds – 90 mA ISB2 Automatic CE Power-down Current – CMOS Inputs VDD = Max, Device Deselected, VIN 0.3 V or VIN > VDDQ – 0.3 V, f = 0 All speeds – 80 mA ISB3 Automatic CE Power-down Current – CMOS Inputs VDD = Max, Device Deselected, VIN 0.3 V or VIN > VDDQ – 0.3 V, f = fMAX = 1/tCYC All speeds – 90 mA ISB4 Automatic CE Power-down Current – TTL Inputs VDD = Max, Device Deselected, VIN VIH or VIN VIL, f = 0 All speeds – 80 mA Electrical Characteristics Over the Operating Range DC Electrical Characteristics (continued) Over the Operating Range Parameter [15, 16] Description Test Conditions Min Max Unit Capacitance Parameter [17] Description Test Conditions 165-ball FBGA Max Unit CIN Input capacitance TA = 25 °C, f = 1 MHz, VDD/VDDQ = 2.5 V 5 pF CCLK Clock input capacitance 5pF CI/O Input/Output capacitance 5pF Thermal Resistance Parameter [17] Description Test Conditions 165-ballFBGA Package Unit JA Thermal resistance (junction to ambient) Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA/JESD51. With Still Air (0 m/s) 14.24 °C/W With Air Flow (1 m/s) 12.47 °C/W With Air Flow (3 m/s) 11.40 °C/W JC Thermal resistance (junction to case) 3.92 °C/W JB Thermal resistance (junction to board) 7.19 °C/W Note 17. Tested initially and after any design or process change that may affect these parameters. |
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