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CY7C1440KV25 Datasheet(PDF) 19 Page - Cypress Semiconductor

Part # CY7C1440KV25
Description  36-Mbit (1M36) Pipelined Sync SRAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1440KV25 Datasheet(HTML) 19 Page - Cypress Semiconductor

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CY7C1440KV25
Document Number: 001-94719 Rev. *D
Page 19 of 30
IDD
VDD Operating Supply Current
VDD = Max, IOUT = 0 mA,
f = fMAX = 1/tCYC
4-ns cycle,
250 MHz
–240
mA
ISB1
Automatic CE Power-down
Current – TTL Inputs
VDD = Max, Device Deselected,
VIN  VIH or VIN  VIL,
f = fMAX = 1/tCYC
All speeds
90
mA
ISB2
Automatic CE Power-down
Current – CMOS Inputs
VDD = Max, Device Deselected,
VIN  0.3 V or VIN > VDDQ – 0.3 V,
f = 0
All speeds
80
mA
ISB3
Automatic CE Power-down
Current – CMOS Inputs
VDD = Max, Device Deselected,
VIN  0.3 V or VIN > VDDQ – 0.3 V,
f = fMAX = 1/tCYC
All speeds
90
mA
ISB4
Automatic CE Power-down
Current – TTL Inputs
VDD = Max, Device Deselected,
VIN  VIH or VIN  VIL, f = 0
All speeds
80
mA
Electrical Characteristics
Over the Operating Range
DC Electrical Characteristics (continued)
Over the Operating Range
Parameter [15, 16]
Description
Test Conditions
Min
Max
Unit
Capacitance
Parameter [17]
Description
Test Conditions
165-ball FBGA
Max
Unit
CIN
Input capacitance
TA = 25 °C, f = 1 MHz, VDD/VDDQ = 2.5 V
5
pF
CCLK
Clock input capacitance
5pF
CI/O
Input/Output capacitance
5pF
Thermal Resistance
Parameter [17]
Description
Test Conditions
165-ballFBGA
Package
Unit
JA
Thermal resistance
(junction to ambient)
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51.
With Still Air (0 m/s)
14.24
°C/W
With Air Flow (1 m/s)
12.47
°C/W
With Air Flow (3 m/s)
11.40
°C/W
JC
Thermal resistance
(junction to case)
3.92
°C/W
JB
Thermal resistance
(junction to board)
7.19
°C/W
Note
17. Tested initially and after any design or process change that may affect these parameters.


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