CY7C1440KV25

Document Number: 001-94719 Rev. *D

Page 19 of 30

4-ns cycle,

250 MHz

–240

mA

Automatic CE Power-down

Current – TTL Inputs

All speeds

–

90

mA

Automatic CE Power-down

Current – CMOS Inputs

f = 0

All speeds

–

80

mA

Automatic CE Power-down

Current – CMOS Inputs

All speeds

–

90

mA

Automatic CE Power-down

Current – TTL Inputs

All speeds

–

80

mA

Electrical Characteristics

Over the Operating Range

Over the Operating Range

Description

Test Conditions

Min

Max

Unit

Capacitance

Parameter [17]

Description

Test Conditions

165-ball FBGA

Max

Unit

Input capacitance

5

pF

Clock input capacitance

5pF

Input/Output capacitance

5pF

Thermal Resistance

Parameter [17]

Description

Test Conditions

165-ballFBGA

Package

Unit

Thermal resistance

(junction to ambient)

Test conditions follow standard

test methods and procedures for

measuring thermal impedance,

per EIA/JESD51.

With Still Air (0 m/s)

14.24

°C/W

With Air Flow (1 m/s)

12.47

°C/W

With Air Flow (3 m/s)

11.40

°C/W

Thermal resistance

(junction to case)

3.92

°C/W

Thermal resistance

(junction to board)

7.19

°C/W

Note

17. Tested initially and after any design or process change that may affect these parameters.