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TPS65321A-Q1 Datasheet(PDF) 40 Page - Texas Instruments |
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TPS65321A-Q1 Datasheet(HTML) 40 Page - Texas Instruments |
40 / 43 page ![]() www.ti.com PACKAGE OUTLINE C TYP 6.6 6.2 12X 0.65 14X 0.30 0.19 2X 3.9 (0.15) TYP 0 - 8 0.15 0.05 2.558 1.718 2.548 1.708 4X (0.4) NOTE 5 1.2 MAX 0.25 GAGE PLANE 0.75 0.50 (1) A NOTE 3 5.1 4.9 B 4.5 4.3 4X (0.05) NOTE 5 4223314/A 09/2016 PowerPAD TSSOP - 1.2 mm max height PWP0014G PLASTIC SMALL OUTLINE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. Reference JEDEC registration MO-153. 5. Features may differ and may not be present. PowerPAD is a trademark of Texas Instruments. TM 1 14 0.1 C A B 8 7 PIN 1 ID AREA SEATING PLANE 0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 2.400 THERMAL PAD 1 14 8 7 15 |
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