TM893CBK32, TM893CBK32S

8388608 BY 32-BIT

DYNAMIC RAM MODULE

SMMS652A – FEBRUARY 1995 – REVISED JUNE 1995

3

POST OFFICE BOX 1443

Table 1. Connection Table

DATA BLOCK

RASx

CASx

DATA BLOCK

SIDE 1

SIDE 2

CASx

DQ0 – DQ7

RAS0

RAS1

CAS0

DQ8 – DQ15

RAS0

RAS1

CAS1

DQ16 – DQ23

RAS2

RAS3

CAS2

DQ24 – DQ31

RAS2

RAS3

CAS3

single in-line memory module and components

PC substrate: 1,27

± 0,1 mm (0.05 inch) nominal thickness; 0.005 inch/inch maximum warpage

Bypass capacitors: Multilayer ceramic

Contact area for TM893CBK32: Nickel plate and gold plate over copper

Contact area for TM893CBK32S: Nickel plate and tin-lead over copper