SOD128-FL Datasheet(PDF) - Amkor Technology

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SOD128-FL Datasheet (PDF) - Amkor Technology

SOD128-FL Datasheet PDF - Amkor Technology


Part #	SOD128-FL

Download	SOD128-FL Download

File Size	445.28 Kbytes

Page	2 Pages

Manufacturer	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

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Description

Bare copper leadframe with no plating

SOD128-FL Datasheet (PDF)

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SOD128-FL Datasheet PDF - Amkor Technology


Part #	SOD128-FL

Download	SOD128-FL Click to download

File Size	445.28 Kbytes

Page	2 Pages

Manufacturer	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

Logo

Description	Bare copper leadframe with no plating

SOD128-FL Datasheet (HTML) - Amkor Technology

SOD128-FL Datasheet HTML 1Page - Amkor Technology

SOD128-FL Datasheet HTML 2Page - Amkor Technology

Similar Part No. - SOD128-FL

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Amkor Technology	SOD128-FL-V01	577Kb / 2P	The SOD128-FL package is part of the FLAT series of compact surface mount packages which allow communication equipment to be miniaturized. 02/21

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About Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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