Manufacturer | Part # | Datasheet | Description |
Maxim Integrated Produc... |
21-0664
|
46Kb / 2P |
PACKAGE OUTLINE 12L TDFN, 3*3*0.75MM
REV .B |
90-0397
|
27Kb / 1P |
PACKAGE LAND PATTERN, 12L TDFN, 3*3
Rev C |
21-0429
|
71Kb / 2P |
PACKAGE OUTLINE, 10L TDFN, 3*2*0.75MM
REV .C |
21-0137
|
48Kb / 2P |
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM
Rev J |
Zetex Semiconductors |
MLP322
|
176Kb / 3P |
Surface mounted, 3 pin package Package outline
|
TO92
|
87Kb / 2P |
Through hole, 3 pin package Package outline
|
SparkFun Electronics |
ROB-12141
|
90Kb / 1P |
Shaft - Solid (Stainless; 3/8D x 12L)
2/10/2016 |
Maxim Integrated Produc... |
21-0093
|
38Kb / 1P |
PACKAGE OUTLINE, 9 BUMPS, 3*3 ARRAY, UCSP(B)PKG.
Rev M |
Advanced Power Electron... |
AP2900EC4
|
98Kb / 7P |
Ultra-small Package Outline
|
SparkFun Electronics |
ROB-12394
|
91Kb / 1P |
Shaft - Solid (Stainless; 3/16D x 12L)
2/11/2016 |